项 目 |
技术标准 |
备 注 |
| 层 数 |
2-10层 |
|
| 材 料 |
CEM-3,FR-4 |
|
| 板 厚 |
0.2mm-3.2mm (8mil-126mil) |
|
| 最小芯板厚 |
0.1mm(4mil) |
|
| 铜 厚 |
Min:1/3 oz;Max:3 oz |
|
| 最小线宽/间距 |
0.075mm(3mil) |
|
| 最小钻孔孔径 |
0.25mm(10mil) |
|
| 最小冲孔孔径 |
0.9mm(35mil) |
|
公
差 |
钻孔孔位 |
±0.075mm(3mil) |
|
线宽
|
±0.05mm(2mil) |
|
孔径 |
PTH±0.075mm(3mil)
NPTH±0.05mm(2mil)
|
|
外型公差 |
铣床±0.13MM(6mil)
冲床±0.10mm(4mil)
|
|
翘曲度 |
>0.7 |
|
表面处理 |
Gold Plating/Immersion Gold/HAL/
HAL lead-free/Immersion Silver/Entek
|
|
绝缘电阻 |
10KΩ-20MΩ |
|
传导电阻 |
<50Ω |
|
测试电压 |
300V |
|
| V刻 |
拼板尺寸 |
Min:110×100mm
Max:660×600mm
|
|
| 板厚 |
Min:0.6mm(24mil) |
|
| 余厚 |
Min:0.3mm(12mil) |
|
| 公差 |
±0.1mm(4mil) |
|
| 槽宽 |
Max:0.50mm(20mil) |
|
| 槽到槽 |
Min:10mm |
|
| 槽到线 |
Min:0.50mm(20mil) |
|
| 槽 |
Slot size tol.>=2W公差 |
PTH L:±0.15mm(6mil)
W:±0.1mm(4mil) |
|
| NPTH L:±0.125mm(5mil)
W:±0.1mm(4mil) |
最小焊环 |
PTH:0.13mm(5mil) |
|
| NPTH:0.18(7mil) |
|
|
多层板
|
孔位偏差 |
0.075mm(3mil) |
|
| 层间偏差 |
4 layers: Max 0.15mm(6mil) |
|
| 6 layers: Max 0.025mm(10mil) |
|
| 内层最小绝缘环 |
0.25mm(10mil) |
|
| 内层线路到板边最小距离 |
0.25mm(10mil) |
|
| 板厚 |
6 layers:±0.15mm(6mil) |
|
| 特性阻抗 |
60 Ω±10% |
|
